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会议通知 | ​第十八届IEEE国际固态和集成电路技术会议(ICSICT 2026)征文通知

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会议通知 | ​第十八届IEEE国际固态和集成电路技术会议(ICSICT 2026)征文通知

第十八届IEEE

国际固态和集成电路技术会议

2026 IEEE 18thInternational Conference on Solid-State and Integrated Circuit Technology (ICSICT)

2026年10月27日-30日

中国 · 杭州

会议简介

由 IEEE 中国联合会、IEEE 北京分会、四川省电子学会及武汉理工大学联合主办,电子科技大学长三角研究院(湖州)承办的 2026 IEEE 第十八届国际固态和集成电路技术会议(2026 IEEE 18th International Conference on Solid-state and Integrated Circuit Technology, ICSICT 2026),定于2026年10 月27日至30日在杭州举办。作为中国每两年一届的顶尖学术盛会,ICSICT是固态器件与集成电路领域规模最大、影响力最深远的国际会议之一。

本届会议聚焦固态数字集成电路与系统设计、模拟电路、器件研发、工艺技术等核心方向,为期四天的议程将通过口头报告、海报展示、专题研讨及特色活动等多元形式,全面呈现全球该领域的前沿突破与创新成果。会议以“推进集成电路技术进步、促进产学研深度融合”为宗旨,届时将有来自世界各国和地区学术界、产业界的 500 余位杰出代表齐聚杭州,共话技术发展趋势,探索产业应用前景。

ICSICT

Co-sponsored by

会议通知 | ​第十八届IEEE国际固态和集成电路技术会议(ICSICT 2026)征文通知

ICSICT

Technically Co-sponsored by

会议通知 | ​第十八届IEEE国际固态和集成电路技术会议(ICSICT 2026)征文通知

ICSICT

Hosted by

会议通知 | ​第十八届IEEE国际固态和集成电路技术会议(ICSICT 2026)征文通知

ICSICT

Supported by

会议通知 | ​第十八届IEEE国际固态和集成电路技术会议(ICSICT 2026)征文通知

ICSICT

Media Partner

会议通知 | ​第十八届IEEE国际固态和集成电路技术会议(ICSICT 2026)征文通知

会议组委会

↓ 上下滑动查看完整组委会名单 ↓

Life Honorary Chair

  • Yangyuan Wang,Peking University, China

Advisory Committee Co-Chairs

  • Ting-Ao Tang, Fudan University, China

  • Cor Claeys, Proximus, Belgium

  • Mengqi Zhou, IEEE China Council, China

General Chairs

  • Jan Van der Spiegel, University of Pennsylvania, USA

  • Bin Zhao, IEEE EDS, USA

  • Francois Rivet, University of Bordeaux, France

  • Amara Amara, International Innovation Institute, Beihang University, Hangzhou Campus, China

General Co-Chairs

  • Ning Xu, Wuhan University of Technology, China

  • Cheng Zhuo, Zhejiang University, China

  • Yuehang Xu, Yangtze Delta Region Institute of University of Electronic Science and Technology of China, Huzhou, China

  • Gaofeng Wang, Hangzhou Dianzi University, China

Technical Program Committee Chairs

  • Haruo Kobayashi, Gunma University, Japan

  • Ming Li, Peking University, China

  • Bo Zhang, University of Electronic Science and Technology of China, China

  • Yi Zhao, Huada Semiconductor, China

Technical Program Committee Co-Chairs

  • Bei Yu, The Chinese University of Hong Kong, China

  • Zheng Wang, University of Electronic Science and Technology of China, China

  • Fakhrul Zaman Rokhani,Universiti Putra Malaysia, Malaysia

  • Ling Zhang, Zhejiang University, China

  • Yuchao Yang, Peking University, China

  • Jing Jin, Shanghai Jiao Tong University, China

  • Wentong Zhang, University of Electronic Science and Technology of China, China

  • Haifeng Ling, Nanjing University of Posts and Telecommunications, China

Local Arrangement Chair

  • Letian Huang, Yangtze Delta Region Institute of University of Electronic Science and Technology of China, Huzhou, China

Subcommittee Chairs

  • Haifeng Ling, Nanjing University of Posts and Telecommunications, China

  • Wentong Zhang, University of Electronic Science and Technology of China, China

  • Jing Jin, Shanghai Jiao Tong University, China

  • Yuchao Yang,Peking University, China

Subcommittee Co-Chairs

  • Hailong Jiao, Peking University, China

  • Zheng Wang, University of Electronic Science and Technology of China, China

  • Jin Wei, Peking University, China

  • Zhihao Yu, Nanjing University of Posts and Telecommunications, China

Special Session Chair

  • Haimeng Huang, University of Electronic Science and Technology of China, China

Tutorial Chair

  • Wei Mao, Xidian University, China

Industry Liaison Chairs

  • Sylvain Eimer, Truth Equipment, China

  • Preet Yadav, NXP Semiconductors, India

Publicity Co-Chairs

  • Caoyu Li,Yangtze Delta Region Institute of University of Electronic Science and Technology of China, Huzhou, China

  • Chaoyue Zheng, Yangtze Delta Region Institute of University of Electronic Science and Technology of China, Huzhou, China

Publication Committee Chair

  • Mengqi Zhou, IEEE China Council, China

Publication Committee Co-chairs

  • Lobna A. Said, Nile University, Egypt

  • Guoqing Deng, Sichuan Institute of Electronics, China

Treasurer

  • Jianhong Zhou, Xihua University, China

Secretary General

  • Tiantian Han, Yangtze Delta Region Institute of University of Electronic Science and Technology of China, Huzhou, China

征稿主题

Theme 1: Digital & System Level IC

  • Chair: Yuchao Yang, Peking University, China

  • Co-Chair: Hailong Jiao, Peking University, China

Track 1: Digital Architectures & Systems

Chair:

  • Zhiyi Yu, Sun Yat-sen University, China

Co-Chairs:

  • Yaoyu Tao, Peking University, China

  • Hongyang Jia, Tsinghua University, China

Track 2: Digital Circuits

Chair:

  • Yongpan Liu, Tsinghua University, China

Co-Chairs:

  • Yanan Sun, Shanghai Jiao Tong University, China

  • Fengbin Tu, Hong Kong University of Science and Technology, China

Track 3: Design Methodology & EDA

Chair:

  • Jun Yang, Southeast University, China

Co-Chairs:

  • Yibo Lin, Peking University, China

  • Yu Li, Zhejiang University, China

Theme 2: Analog

  • Chair: Jing Jin, Shanghai Jiao Tong University, China

  • Co-Chair: Zheng Wang, University of Electronic Science and Technology of China, China

Track 4: RF & Wireless

Chair:

  • Keping Wang, Tianjin University, China

Co-Chairs:

  • Jian Pang, Shanghai Jiao Tong University, China

  • Kai Tang,Hunan University, China

Track 5: Wireline

Chair:

  • Xiaoyan Gui, Xi'an Jiaotong University, China

Co-Chairs:

  • Bingyi Ye, East China Normal University, China

  • Yuekang Guo, Shanghai Jiao Tong University, China

Track 6: General Analog

Chair:

  • Lin Cheng, University of Science and Technology of China, China

Co-Chairs:

  • Junmin Jiang, Southern University of Science and Technology, China

  • Ang Hu, Huazhong University of Science and Technology, China

Theme 3: Devices

  • Chair: Wentong Zhang, University of Electronic Science and Technology of China, China

  • Co-Chair:Jin Wei, Peking University, China

Track 7: CMOS Logic Devices & Sensors

Chair:

  • Heng Wu, Peking University, China

Co-Chairs:

  • Wang Kang, Beihang University, China

  • Xiaosheng Zhang, University of Electronic Science and Technology of China, China

Track 8: Power Devices & Power IC

Chair:

  • Long Zhang, Southeast University, China

Co-Chairs:

  • Jiafei Yao, Nanjing University of Posts and Telecommunications, China

  • Zekun Zhou, University of Electronic Science and Technology of China, China

Track 9: Device Reliability & Security

Chair:

  • Mengyuan Hua, Southern University of Science and Technology, China

Co-Chairs:

  • Sen Huang, Institute of Microelectronics of Chinese Academy of Sciences, China

  • Zhao Qi, University of Electronic Science and Technology of China, China

Theme 4: Process & Technologies

  • Chair: Haifeng Ling, Nanjing University of Posts and Telecommunications, China

  • Co-Chair: Zhihao Yu, Nanjing University of Posts and Telecommunications, China

Track 10: Semiconductor Process Technologies

Chair:

  • Bobo Tian, East China Normal University, China

Co-Chairs:

  • Min Liao, Xidian University, China

  • Li Zhu, Nanjing University of Posts and Telecommunications, China

Track 11: Optoelectronics and Silicon Photonics Integration

Chair:

  • Linfeng Sun, Beijing Institute of Technology, China

Co-Chairs:

  • Ming Xu, Huazhong University of Science and Technology, China

  • Yuanfang Yu, Nanjing University of Posts and Telecommunications, China

Track 12: Packaging Technologies

Chair:

  • Jun Zhang,Nanjing University of Posts and Telecommunications, China

Co-Chairs:

  • Shenyang Mo,NARI Semiconductor R&D Center, China

  • Pengfei Zhao, Nanjing University of Posts and Telecommunications, China

投稿方式

投稿作者需按照论文模板撰写论文,提交至少3页的英文文章,被录用文章将收录于会议论文集。

或前往easychair投稿

https://easychair.org/conferences/?conf=icsict2026

投稿要求

论文模板

重要时间

征稿截止日期:2026年6月25日

录用通知日期:2026年7月25日

组织特别分会

ICSICT 2026组委会邀请专家学者积极组织特别分会,展示自己的先进研究成果!

有意组织的学者请在2026年2月1日前将提案发送至会议邮箱。(ieeeicsict@outlook.com)。

提案模板

通过下方链接下载:

https://www.icsict.org/ICSICT_2026_Special_Session_Proposal_Template.docx

相聚杭州

杭州市,坐落于风景如画江浙腹地,是一座以永恒之美和丰富文化遗产闻名的城市。

杭州最著名的景点之一是西湖,它被联合国教科文组织列为世界遗产。除此之外,京杭大运河、灵隐寺、钱塘江以及新兴升起的电子商务产业,都让这座富有历史底蕴的城市散发新的光芒。

ICSICT 2026组委会诚挚邀请您参与会议,于金秋10月相约在这座美丽的城市!

会议通知 | ​第十八届IEEE国际固态和集成电路技术会议(ICSICT 2026)征文通知会议通知 | ​第十八届IEEE国际固态和集成电路技术会议(ICSICT 2026)征文通知会议通知 | ​第十八届IEEE国际固态和集成电路技术会议(ICSICT 2026)征文通知

联系方式

会议秘书:钟女士

联系电话:+86-186 282 638 76

会议邮箱:

icsict2026@csj.uestc.edu.cn

ieeeicsict@outlook.com

会议官网:www.icsict.org

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